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Mounting electronic components on flexible plastic substrates, such as polyimide, PEEK, or transparent conductive polyester film, is the method used in the technology known as flexible electronics, which is also known as flex circuits. This method is used to assemble electronic circuits. In addition to this method, silver circuits may be screen printed on polyester to create flex circuits. It is possible to build flexible electronic assemblies using the same components that are used to produce rigid printed circuit boards. This gives the board the ability to adapt to any desired shape and to bend while it is in use.
How You Will Benefit
(I) Insights, and validations about the following topics:
Chapter 1: Flexible electronics
Chapter 2: Organic electronics
Chapter 3: Printed circuit board
Chapter 4: BoPET
Chapter 5: Roll-to-roll processing
Chapter 6: Lamination
Chapter 7: FR-4
Chapter 8: Polyimide
Chapter 9: Thin film
Chapter 10: Membrane switch
Chapter 11: Diffusion barrier
Chapter 12: Flexible flat cable
Chapter 13: Power electronic substrate
Chapter 14: Tape-automated bonding
Chapter 15: Printed electronics
Chapter 16: IPC (electronics)
Chapter 17: Thermal copper pillar bump
Chapter 18: Integrated passive devices
Chapter 19: Film capacitor
Chapter 20: Stéphanie P. Lacour
Chapter 21: Glossary of microelectronics manufacturing terms
(II) Answering the public top questions about flexible electronics.
(III) Real world examples for the usage of flexible electronics in many fields.
(IV) 17 appendices to explain, briefly, 266 emerging technologies in each industry to have 360-degree full understanding of flexible electronics' technologies.
Who This Book Is For
Professionals, undergraduate and graduate students, enthusiasts, hobbyists, and those who want to go beyond basic knowledge or information for any kind of flexible electronics.
Verlag:
One Billion Knowledgeable
Veröffentlicht:
2022
Druckseiten:
ca. 168
Sprache:
English
Medientyp:
eBook